Monday, May 27, 2024

MediaTek Dimensity 6300: 108MP Cameras & 50% Faster GPU

MediaTek Dimensity 6300

Enabling 5G smartphones that are widely used with faster gaming and better photographs

The MediaTek Dimensity 6300 bears a striking resemblance to several MediaTek models from the past, even with its new moniter. However, the OEM claims that smartphones built on this silicon will be equipped with all the modern capabilities, including 5G UltraSave 3.0+ power-efficiency improvements and HyperEngine “gaming technologies,” to allow them to compete in the 2024 market for reasonably priced 5G handsets.

Although the name of MediaTek’s most recent CPU release may suggest that the Dimensity 9300 has finally been redesigned for the mid-range market, the silicon in question is really built on an older 6 nanometer (nm) architecture and features the ARM Mali-G57 MC2 GPU.

Although it has the well-known 2 Cortex-A76 + 6 Cortex-A55 ARM core arrangement, cellphones built on this “new” CPU could be up to 10% faster than those built on its immediate processor, the Dimensity 6100+, thanks to its top speed of 2.4GHz.

However, it’s impossible to overlook the parallels between it and the Dimensity 810 from 2021, which include support for outdated standards like Wi-Fi 5, LPDDR4X RAM, and UFS 2.2 flash storage and more.

However, the MediaTek Dimensity 6300 adopts Bluetooth 5.2 instead of 5.1 for the 810, supports 120Hz refresh rates (but only for FHD+ displays; no mention is made of more recent 1.5K resolutions), and has a primary camera that can capture up to 108MP images “with Enhanced Noise Reduction.”

It’s expected that the MediaTek Dimensity 6300 will soon be released in the shape of the Realme C65 and other reasonably priced Android smartphones.

Improved Noise Reduction in 108MP Cameras

108MP camera sensors are natively supported, resulting in remarkably detailed images. In low light, pre-integrated multiframe noise reduction produces a steady, clear image.

MediaTek HyperEngine: Quicker Gaming Experience

Users may now game up to 10% quicker than they could on prior generations’ CPUs and have a GPU performance advantage of over 50% over competing platforms thanks to the boost to 2.4GHz CPU speeds.

With up to 11% more power efficiency, up to 13% more frames per second in demanding gameplay scenarios, intelligent connection prediction between 5G and Wi-Fi, 5G Call/Data concurrency, and more dependable connectivity to guarantee gamers never lose connection, MediaTek HyperEngine gaming technologies infuse the entire smartphone gaming experience.

Billions of Colour Displays

View billion colour displays with contour-free true colours, and enjoy real 10-bit images and movies on true colour AMOLED screens, which improve user experience. With display speeds up to 120 Hz, users can enjoy exceptionally fluid interactions with apps and pages, including animations. This helps lessen eye strain.

Modem 3GPP R16 Standard

A 3GPP Release-16 standard 5G modem with the most recent connection improvements now being used by international cellular operators is included in the MediaTek Dimensity 6300. One smartphone design may be made for all cellular markets worldwide by device designers, greatly cutting costs and speeding up global rollout.

5G UltraSave 3.0+ MediaTek

In typical 5G sub-6GHz connectivity circumstances, MediaTek 5G UltraSave 3.0+ offers a full range of R16 power saving advancements in addition to MediaTek’s own optimizations that yield 13–30% higher power efficiency than competing options.

Faster 5G with Greater Range

Up to 3.3Gb/s 5G downlink via 2CC carrier aggregation is possible by addressing a maximum of 140MHz cellular spectrum. This represents up to 40% faster downlink speeds in metropolitan areas and up to 30% faster downlink speeds in suburbs when compared to competitor alternatives. With the application of mixed duplex FDD+TDD, which combines the benefits of low and mid-band, smartphones in CA can enjoy higher speeds and a wider range. Additionally, carrier aggregation allows for a smooth changeover between two 5G connection areas at the coverage layer, giving consumers more than 30% more throughput layer coverage than they would have without CA.

Situationally-Aware Improvements

When using a car underground or high-speed train, MediaTek’s 5G modem detects the connection environment and uses situationally intelligent optimisations intended to offer 20% faster downlink speeds than competing options.

Support for 8-layer DL MIMO and LB+LB ENDC

A smartphone that is future-proof is one that supports the most recent cellular operator specifications, such as dual, low-band ENDC and 8-layer DL MIMO.

Compact & Exceptionally Power-efficient Platform

Even for discerning smartphone consumers, a prolonged battery life is guaranteed by using the TSMC 6nm-class chip fabrication process. The more compact platform that MediaTek’s engineering advancements have produced also allows device designers greater creative freedom.

MediaTek Dimensity 6300 Specifications

Processor

CPU Type(s)

2X Arm Cortex-A76 up to 2.4GHz

6X Arm Cortex-A55 up to 2.0GHz

Cores

Octa (8)

CPU Bit

64-bit

Heterogeneous Multi-Processing

Yes

Memory and Storage

Memory Type

LPDDR4x

Max Memory Frequency

2133MHz

Storage Type

UFS 2.2

Graphics

GPU Type

Arm Mali-G57 MC2

Camera

Max Camera ISP

  • Native 108MP
  • 16MP + 16MP

Display

Max Display Resolution

2520 x 1080

Max Refresh Rate

Up to 120Hz

Connectivity

Cellular Technologies

2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA

Specific Functions

SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 140 MHz bandwidth, 256QAM NR UL 2CC, 256QAM VoNR, Dual VoNR, Dual 5G SIM, EPS fallback

Peak Download Speed

3.3Gbps

GNSS

  • GPS L1CA+L5
  • BeiDou B1I+ B2a
  • Glonass L1OF
  • Galileo E1 + E5a
  • QZSS L1CA+ L5
  • NavIC

Wi-Fi Antenna

1T1R

Wi-Fi

Wi-Fi 5 (a/b/g/n/ac)

Bluetooth Version

5.2

agarapuramesh
agarapurameshhttps://govindhtech.com
Agarapu Ramesh was founder of the Govindhtech and Computer Hardware enthusiast. He interested in writing Technews articles. Working as an Editor of Govindhtech for one Year and previously working as a Computer Assembling Technician in G Traders from 2018 in India. His Education Qualification MSc.
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