CXL memory pooling
Samsung unveiled its state-of-the-art CXL DRAM memory pooling product, the CXL Memory Module – Box (CMM-B), to highlight the expanding momentum in the CXL ecosystem. The Samsung CMM-B has a capacity of up to two terabytes (TB) and can hold eight CMM-D devices with the E3.S form factor. AI, in-memory databases (IMDB), data analytics, and other applications requiring large memory capacities may benefit from the enormous memory capacity combined with high efficiency of as much as 60 gigabytes-per-second (GB/s) as well as a latency of 596 a nanosecond (ns).
Samsung also showcased the first Rack-Level memory solution for highly scalable and composable disaggregated infrastructure in collaboration with Supermicro, a pioneer in Plug and Play Rack-Scale IT solutions worldwide. Unlike typical designs, which lack the flexibility and efficiency required for current applications, this innovative solution makes use of Samsung’s CMM-B to enhance memory capacity and bandwidth, allowing data centres to manage demanding workloads. Applications like AI, IMDB, data analytics, and more that need high-capacity memory may benefit from the enhanced memory capacity and high-performance of up to 60GB/s bandwidth per server.
Samsung CXL memory expander
Reiterating its leadership in high-performance and high-capacity solutions for AI applications, Samsung Electronics, a global leader in advanced semiconductor technology, announced the extension of its Compute Express Link (CXL) memory module portfolio and demonstrated its most recent HBM3E technology.
What is CXL memory?
Unlike DDR5 or HBM2E, CXL memory, usually referred to as CXL-attached memory, isn’t precisely a particular kind of memory. Rather, the Compute Express Link (CXL) connection standard makes this idea possible.
CXL memory controller
SangJoon Hwang, Corporate Executive Vice President, Head of DRAM Product and Technology at Samsung Electronics, and Jin-Hyeok Choi, Corporate Executive Vice President, Device Solutions Research America Memory at Samsung Electronics, utilised centre stage to announce the latest memory methods and talk regarding how Samsung Electronics is advancing HBM and Compute Express Link (CXL) in the AI era. The event was held in front of a full house at Santa Clara’s Computer History Museum. Gunnar Hellekson, vice president and general manager at Red Hat, and Paul Turner, vice president, product team, VCF division at VMware by Broadcom, joined Samsung on stage to talk about how their software solutions, when paired with Samsung’s hardware technology, are pushing the envelope in memory innovation.
According to Choi, “innovation in memory technology is essential for the advancement of AI.” As the leader in the memory market, Samsung is pleased to keep pushing innovation with products like the most sophisticated CMM-B technology in the business and potent memory solutions like HBM3E for demanding AI applications and high-performance computing. In order to jointly realise the full potential of the AI age, they are dedicated to working with their partners and providing for their clients.
CXL memory sharing
The world’s first FPGA (Field Programmable Gate Arrays)-based tiered memory solution for hypervisors, known as the CXL Memory Module Hybrid for Tiered Memory (CMM-H TM), was also unveiled on stage by Samsung and VMware by Broadcom as part of project Peaberry. In order to address memory management issues, minimise downtime, optimise scheduling for tiered memory, and optimise performance all while drastically lowering total cost of ownership (TCO) this hybrid system combines DRAM and NAND storage in an Add-in Card (AIC) design factor.
Paul Turner said, “VMware by Broadcom is happy to collaborate with Samsung to bring new innovations in memory.” “A new innovation in CXL and a compelling value-proposition with significant TCO benefits, better utilization of expensive DRAM resources, and improved consolidation of server resources while delivering the same great performance are made possible by Samsung’s leadership in memory technologies and VMware‘s leadership in software memory tiering.”
CXL memory expansion
CXL Memory Module
Furthermore, Samsung demonstrated its CXL Memory Module DRAM (CMM-D) technology, which combines the CXL open standard interface with Samsung’s DRAM technology to provide effective, low-latency communication between the CPU and memory expansion devices. For the first time in the market, Red Hat, a pioneer in open source software solutions, successfully verified Samsung’s CMM-D devices with its business software last year. Through Samsung Memory Research (SMRC), the two businesses will keep working together to create CXL reference and open-source models in addition to working together on a variety of other storage and memory solutions.
Additionally, Samsung provided 2024 Memcon guests with a demo of its most recent HBM3E 12H chip, which is the first 12-stack HBM3E DRAM in the world and represents a breakthrough with the largest capacity in HBM technology. By using the company’s cutting-edge thermal compression non-conductive film (TC NCF) technology, the HBM3E 12H improves both product yield and vertical density of the chip by more than 20% when compared to its predecessor. Samsung intends to begin mass manufacturing of the HBM3E 12H during the first half of this year, and is presently providing samples to customers.
Enabling cxl memory expansion for in-memory database management systems
In-memory database management systems (IMDBMS) might potentially circumvent the constraints of standard memory architectures by enabling CXL memory extension. Here’s how the idea is broken down:
Traditional Memory’s Drawbacks for IMDBMSs
- Capacity restrictions: The main memory (DRAM) of a server might easily get overloaded with large datasets utilised by IMDBMS. Performance is impacted as a result of forcing data switching to slower storage (SSD/HDD).
- Bottlenecks caused by latency: Accessing data from slower storage causes latency, which reduces the performance benefit of in-memory databases.
Concerning Samsung Electronics
Samsung’s revolutionary concepts and innovations inspire people all across the globe and help to build the future. Through its SmartThings ecosystem and open cooperation with partners, the firm is transforming the worlds of TVs, smartphones, wearables, tablets, home appliances, network systems, memory, system LSI, foundry, and LED solutions. It is also creating a seamless connected experience.
