AMD Expects Higher Density Ryzen Chips to Increase CPU Temperatures
It would seem that AMD is of the opinion that, in light of recent developments in Ryzen Chips density, the average temperatures of CPUs will continue to rise with subsequent generations of Ryzen Chips.
AMD is collaborating with TSMC on the optimization of process technology, but the company anticipates that Ryzen Chips central processing unit temperatures may rise in the future due to the increased density of Ryzen Chips.
The central processing units (CPUs) made by AMD with the model number Ryzen 7000 are currently the most power-efficient processors on the market for client computers. The Zen 4 core architecture that they pack promises huge benefits in both single-threaded and multi-threaded performance.
These improvements are the result of greater number of transistors plus numerous modification to the development. However, this additionally results in a significant increase in the interior temperature of the central processing unit (CPU), considering that additional transistors move into a smaller amount of space.
At their default settings, the most recent Ryzen 7000 CPUs, which go by the codename Raphael, generate an extreme amount of heat. They often reach the top Tjmax of 95C while doing any work that places a high demand on the CPU and need a great deal of cooling performance in order to be overclocked.
Q. The CPU temperature is one of the complaints leveled against AMD desktop products. Although the temperature is greater, the CPU power consumption is obviously lower than that of the competition. Will there be a future solution to these temperature problems? Is it not feasible to place a fake die adjacent to the CCD die in order to promote heat dissipation?
A. To make significant progress in process technology, we are actively collaborating with TSMC. We also need to be able to ensure the stability and quality of semiconductors. We think that the high heat density phenomena we now see will either persist or become more intense in the future as more sophisticated methods are used. Consequently, in the future, it will be crucial to figure out how to efficiently reduce the high heat density produced by these high-density chiplets.
Furthermore, the TDP 65 W device has outstanding overall performance. He feels that this is a crucial component to take into account when creating a future roadmap in order to guarantee a healthy balance between TDP and heat generation based on these product examples.
Even while AMD anticipates that this trend will continue in future generations as chip density continues to improve, the CPUs may also be undervolted in order to maintain practically the same level of performance while seeing temperature reductions of up to a few degrees Celsius.
A thermal density chart that illustrates the amount of heat being expelled via the die’s reduced surface area is also shown below:
AMD Zen Density Evolution Chart:
| CPU CORE | PROCESS NODE | DIE SIZE | TRANSISTORS | CHIP DENSITY |
|---|---|---|---|---|
| Zen 1 | 14nm | 212mm2 | 4.8 Billion | 22.64 MTr/mm2 |
| Zen 2 | 7nm | 76mm2 | 3.8 Billion | 50.00 MTr/mm2 |
| Zen 3 | 7nm | 84mm2 | 4.1 Billion | 49.40 MTr/mm2 |
| Zen 4 | 5nm | 71mm2 | 6.6 Billion | 92.54 MTr/mm2 |
Intel Corporation is additionally of the view that the total amount of heat generated from CPUs will keep on growing in the not-too-distant future. The manufacturer’s recently released 14th Generation CPUs constitute some of the fastest processors readily accessible, exceeding a maximum operating maximum temperature of basically hundred degrees Celsius.
Given this, motherboards designers have raised the temperature requirements over 115 Celsius degrees, causing the transistor to keep working at the temperatures of greater than 121 temperatures Celsius.
Therefore, according to Intel engineers, it is predicted because contemporary processors are made to run at their peak temperature for extended periods of time. When it comes to CPU throttling, AMD’s CPUs demonstrate that even when they reach their thermal thresholds. This is similar to stating that you must push your chip to its absolute limits in terms of power and thermal capacity if you want the best possible performance.
According to this, we should anticipate seeing a trend toward greater temperatures in the next AMD and Intel CPU generations. We are hoping that the improvement in performance will offset the increased heat emission to some extent. One thing is certain: makers of cooling equipment will take a more creative approach and create fresh designs for systems that use both liquid and air cooling.
