Micron’s 8000 MT/s 128GB DDR5 RDIMM Supercharges Servers!

Micron has released the fastest DDR5 RDIMM memory available, with server speeds of up to 8000 MT/s and capacities of up to 128 GB.

Next-generation RDIMMs with capacities up to 128 GB and memory speeds up to DDR5-8000 MT/s are powered by Micron’s 32 GB DRAM Dies.

Module DDR5 RDIMM

Micron Technology announced its 32GB monolithic die-based 128GB DDR5 RDIMM memory today, which supports data center workloads now and in the future with best-in-class performance of up to 8000 MT/s. These high-capacity, high-speed memory modules meet the needs of mission-critical data center and cloud applications like AI, IMDBs, and efficient processing for multithreaded, multicore count general compute workloads. The 32Gb DDR5 DRAM die-based 128GB DDR5 RDIMM memory, which is powered by Micron’s industry-leading 1β (1-beta) technology, offers the following improvements over rival 3DS through-silicon via (TSV) products:

Innovative die architectural choices are used in Micron’s 32GB DDR5 memory solution to achieve the densest monolithic DRAM die and the highest array efficiency. Features like voltage domain and refresh management aid in power delivery network optimization and provide much-needed increases in energy efficiency. To improve the 32Gb high-capacity DRAM die’s production efficiency, the die-dimension aspect ratio was also improved.

In the shortest amount of time in the company’s history, Micron’s 1β process technology node has reached yield maturity by utilizing AI-powered smart manufacturing techniques to allow these cutting-edge breakthroughs. In 2024, platforms with 4800, 5600, and 6400 MT/s capacity will be shipping Micron’s 128GB RDIMMs; these platforms will also be built to accommodate platforms with up to 8000 MT/s capacity in the future.

Future portfolio extension with improved bandwidth and energy-efficient MCRDIMM and JEDEC standard MRDIMM products in 128GB, 256GB, and larger capacity options is made possible by the Micron 32Gb-DRAM chip. Micron offers a wide range of memory options across RDIMMs, MCRDIMMs, MRDIMMs, CXL, and LP form factors, with industry-leading process and design technology innovations. This enables customers to integrate optimized solutions for AI and high-performance computing (HPC) applications that meet their needs for power, bandwidth, and optimization.

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