Ice Lake D
High-performance SoCs with Ethernet built in, the Intel Xeon D processors are Intel Xeon D-1700 and D-2700 CPUs come in high-density Ball-Grid array packaging. For rugged and embedded applications at the edge, they provide high-bandwidth I/Os, server-class computation, and hardware-based security.
Up to 20 cores, integrated AI acceleration, support for hard-real-time workloads, extreme temperature range, and industrial use circumstances are all features of the Intel Xeon D-1700 and D-2700 processors. They are hence perfect for demanding applications in manufacturing, aerospace, high-bandwidth video analytics, etc.
Key features on Ice Lake D
Enhanced for the Internet of Things, Intel Xeon D processors are a high-density platform that fits server-class processing, I/Os, and accelerated AI into small BGA packages for rugged and soldered-down embedded systems.
Intel Xeon D-1700 and D-2700 SoCs are perfect for high-performance rugged equipment and sealed fanless devices that need to run continuously in the most demanding environments because of their extended operating temperature ranges and industrial-class durability.
Built-in acceleration for AI workloads
The Intel Deep Learning Boost (Intel DL Boost) and Intel AVX-512 instruction sets1 found in Intel Xeon D-1700 and D-2700 processors speed up deep learning inference processing on the CPU cores. With the Intel Distribution of OpenVINO toolkit, developers can optimize inference that can run on any combination of Intel architectures by converting learnt models from almost any framework.
Integrated Intel Time Coordinated Computing (Intel TCC)
At the system level, Intel Time Coordinated Computing (Intel TCC) enhances performance for applications that are sensitive to delay. For systems running real-time operating systems like Yocto Linux with PREEMPT_RT or Wind River VxWorks, as well as real-time hypervisors like ACRN or RTS, developers can use Intel TCC tools to fine-tune the system and enable accurate time and task management.
The Intel TCC offering is enhanced by distinct, standalone Time-Sensitive Networking (TSN) solutions for switches and endpoints that allow timeliness and synchronization among networked devices.
Server-class performance and accelerated AI in rugged applications
Enhanced for the Internet of Things, Intel Xeon D Processors are a high-density architecture that fits server-class processing, I/Os, and accelerated AI into small Ball-Grid Array (BGA) packages for rugged and soldered-down embedded systems. Intel Xeon D-1700 and D-2700 SoCs are perfect for high-performance rugged equipment and sealed fanless devices that need to run continuously in the most demanding environments because of their extended operating temperature ranges and industrial-class durability.
Support high-bandwidth networks and peripherals
The Intel Xeon D-1700 and D-2700 processors provide real server-class connectivity to the edge with up to 56 high-speed PCIe lanes, 32 PCIe 4.0, and 24 customizable PCIe 3.0 lanes, as well as up to 100Gb wired Ethernet. It is possible to set up the 24 PCIe 3.0 lanes as either four USB 3.0 ports or 24 SATA 3.0 connections. High-speed local storage, robot production lines, and massive video camera systems can all be supported by the 32 PCIe 4.0 lanes.
What you can do with Ice Lake D
Vision
More video streams, more storage, and quicker video analytics are supported by high bandwidth, high-speed I/Os, more processors, and higher memory bandwidth generation over generation.
Industrial
Multiple, concurrent process and motion control systems can be operated with high reliability in extended temperatures in finless industrial applications due to real-time capabilities with RAS capability.
Government & Public Sector
Crucial tasks in flight controls and avionics, as well as use in harsh environments.
Intel Xeon D Processor
Built for the Edge
The most recent Intel Xeon D processor provides the high data throughput from the edge that your company requires to its deep integration of computation and high-performance network connectivity.
A Next-Level System-on-Chip
The data Centre edge, networking, storage, and industrial IoT are all supported by the highly integrated design. For deployments aimed at indoor, outdoor, and severe locations throughout a wide range of operating temperatures, it is ideal for the creation of small solutions.
The Intel Xeon D Processors Are Made to Provide
Easily deploy in harsh settings, optimize uptime, lower your overall platform investment, and grow your network capacity in reaction to demand.
Intel Xeon D at the Enterprise Edge
The Intel Xeon D processor drives the enterprise edge’s growing importance in business computing as a workhorse engine for universal customer premise equipment (uCPE). The processor, which is power-efficient and density-optimized, offers the performance required for both the convergence of technologies and demanding local applications.
Topline specifications
| Intel Xeon-D 1700 processors | Intel Xeon-D 2700 processors | |
|---|---|---|
| Cores | Up to 10 | Up to 20 cores |
| Channels | Up to 3 channels DDR4 and 384 GB memory capacity | Up to 4 channels DDR4 and 1,024 GB memory capacity |
| PCIe | Up to 16 PCIe 4.0 + 24 high speed I/Os | Up to 32 PCIe 4.0 + 24 high speed I/Os |
| Thermal Design Power | Supports lower power offerings (40 – 67 W TDP) | 65 – 118W |
| Package Size | 45 mm x 45 mm | 52.5 mm x 45 mm |
| Offerings | Intel Speed Select Technology (Intel SST) Intel Deep Learning Boost Intel Time Coordinated Computing Intel Slim Bootloader (faster boot times) | Intel Deep Learning Boost Intel Time Coordinated Computing Intel Slim Bootloader (faster boot times) |
