Breaking News: Samsung’s HBM4 Memory announced for 2025

It is expected that Samsung Electronics would release its next-generation HBM4 memory around the year 2025

Samsung Electronics has disclosed that it plans to commence mass production of HBM4 memory by the year 2025. This announcement comes as part of the company’s efforts to broaden the range of manufacturing services it offers and to better satisfy the needs of the market.

Samsung has big plans to contribute to the HBM4 Standard, which is going to mark the beginning of the artificial intelligence industry’s transition into the future.

Sang Joon Hwang, the chief of the DRAM Product & Technology Team at Samsung Electronics, announced the new achievement and said that the company plans to develop its memory division in the near future in a recent blog post that was published on Samsung’s media website.

Sang Joon Hwang was quoted as saying that Samsung Electronics is committed to enhancing its memory division. The executive provided the following information on the prior developments that Samsung has made in the HBM industry:

HBM2E and HBM3 were manufactured in big quantities by Samsung as part of the company’s attempts to improve the HPC and AI environment. Additionally, HBM3E, which has a data transmission rate of 9.8 gigabits per second (Gbps), was developed by Samsung. The distribution of HBM3E samples to customers will start very soon.

It is projected that HBM4 will be introduced some time in the vicinity of the year 2025 in the foreseeable future. Assembly methods using non-conductive film (NCF) and hybrid copper bonding (HCB) are two examples of technologies that are now through the process of having their thermal properties improved.

According to the information presented in the article, Samsung has already succeeded in attracting the attention of potential customers who are interested in the HBM3 memory technology that the firm provides, with companies such as NVIDIA taking the lead in this regard.

The need for suitable hardware has reached unprecedented heights as a direct consequence of the spread of advances in genAI. This demand has soared. As a direct result of this, there has been a meteoric surge in the demand for essential components like the HBM3.

NVIDIA is making an attempt to diversify its supply chain, and here is where Samsung Electronics comes in handy since the firm has the skills to satisfy the DRAM demand for AI accelerators. NVIDIA is making these efforts because Samsung Electronics is able to provide these capabilities. Samsung Electronics is helping NVIDIA in its attempts to diversify its supply chain and is providing assistance for these initiatives.

In addition to the progression of the present generation, Samsung plans to make significant developments with the HBM4 technology of the future generation, with the launch of this approach expected for the year 2025. Even if there is a paucity of specific information on the memory type, Samsung has revealed that HBM4 will feature “non-conductive film” in addition to “hybrid copper bonding,” both of which will contribute to the power efficiency and heat dissipation of the memory process.

The launch of HBM4 will, in point of fact, mark the beginning of the transition towards next-generation AI accelerators and will open up new paths in terms of the industry’s capabilities in terms of computing.

It would seem that Samsung will become a “distinctive” supplier, especially taking into consideration the fact that the company is also working on building its skills in the field of chip packaging.

If the firm is successful in gaining the trust of potential clients over the next few years, there is a strong chance that the memory portion of the major Korean corporation may see a return at that time. This is a possibility since there is a good likelihood that the memory section will see a comeback.

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