AMD’s New Genoa X Processors

AMD recently announced several new products at its Data Center and AI Technology Premiere event in San Francisco. One of the highlights is the EPYC Genoa-X processors, which are already shipping. These processors feature up to 1.1GB of L3 cache and are designed for technical workloads such as CAD design and EDA. The Genoa-X chips utilize the Zen 4 architecture and employ the 3D V-Cache technology, which triples the amount of L3 cache per die by using hybrid bonding to add an additional 64MB of 7nm SRAM cache vertically on top of the compute chiplet.

AMD also introduced the 5nm EPYC Bergamo processors for cloud-native applications and the Instinct MI300 processors. The MI300 processors come with 3D-stacked CPU and GPU cores on the same package, along with HBM (High Bandwidth Memory). Additionally, AMD announced a GPU-only MI300X model, which allows for eight accelerators on a single platform with a remarkable 1.5TB of HBM3 memory. All three products—EPYC Bergamo, Instinct MI300, and MI300X—are now available.

Furthermore, AMD revealed its EPYC Sienna processors, designed for telco and edge applications, which are scheduled to arrive in the second half of 2023.

AMD EPYC Genoa-X:

The Genoa-X lineup( AMD EPYC 9684X, AMD EPYC 9384X and AMD EPYC 9184X ) offers various models with different core counts and specifications. The highest-end model features 96 cores and up to 1.1GB of L3 cache, while the lowest-end model has 16 cores and 768MB of L3 cache. The chips are compatible with existing SP5 sockets, allowing for easy integration into the current server and workstation ecosystem. The TDP (thermal design power) ranges from 320W for the 16-core chip to 400W for the 96-core chip.

AMD provided benchmarks demonstrating the superior performance of Genoa-X compared to Intel’s 80-core 8490H Xeon and other Intel Xeon models with the same number of cores. The Genoa-X processors showcased significant gains in various technical workloads.

In addition, Microsoft announced that its Azure cloud platform now offers general availability of new instances, including HBv4 and HX-series instances powered by Genoa-X, as well as HBv3 instances. Microsoft also presented benchmarks that show impressive performance gains, with the highest increase reaching up to 5.7 times.

These new AMD products and partnerships demonstrate the company’s commitment to delivering powerful and innovative solutions for data centers, AI, and cloud computing.