Thursday, November 7, 2024

TSMC vs Competitors: AI Chip Dominance

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TSMC to Expand AMD & NVIDIA AI Chip CoWoS wrapping Facilities “Aggressively”

TSMC is aiming towards a “aggressive” expansion of the CoWoS containers that it employs in order to create place for artificial intelligence chips that will be developed by AMD and NVIDIA. This will allow TSMC to better accommodate these chips.

It has been reported that in order to meet the surge in demand from technical behemoths such as NVIDIA and AMD, TSMC has increased the number of orders it has placed for extremely complicated CoWoS packaging equipment. This is believed to have occurred in reaction to the surge in demand.

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There is No Way That TSMC Would Be Left Out of This, and the Taiwanese Giant Has Every Intention of Satisfying Their Customers, Including NVIDIA and AMD.

If TSMC were to increase its capabilities in terms of CoWoS, this would in no way put the company at a disadvantage.

According to the Taiwan Economic Daily, rival companies in the field of artificial intelligence are reportedly “rushing” towards TSMC in an effort to capitalise on the excitement that is now surrounding genAI.

As a direct result of this, there is currently a considerable need for vital components such as artificial intelligence graphics processing units (AI GPUs) made by NVIDIA, Intel, and AMD.

TSMC on AMD
image credit to AMD

Because the company’s facilities haven’t truly reached the “required” production level yet, the Taiwanese behemoth is currently unable to meet the demand, notably for CoWoS packaging. This is especially true for the company’s packaging products. This is especially true for the products that the company provides in the domain of packaging, which you can browse through on their website.

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Recent sources indicate that TSMC has made further orders for extremely sophisticated packaging equipment, which may account for an increase that is anywhere from twenty-five to thirty percent. NVIDIA and maybe other companies may be required to endure “bottlenecks” in the supply chain for the time being since the actual installation is anticipated to take place before the end of this year.

According to the source, TSMC’s monthly wafer production may potentially reach up to 30,000, which would represent an increase of one hundred percent in comparison to the number that it is now producing.

It is estimated that by the beginning of the year 2024, manufacturing will have expanded to anywhere between 15,000 and 20,000 wafers from its current level of about 12,000 wafers. At the present, there are approximately 12,000 wafers being made.

Fab enterprises such as TSMC have been struck with demand that was not foreseen, and as a result, the company is now having trouble keeping up with the orders that have already been made for its various products. This is a direct result of the tremendous breakthroughs in technology tied to artificial intelligence that have taken place in recent years.

On the other hand, there are indicators from the industry which suggest that TSMC is working towards modernising current facilities since, ultimately, it is the most trustworthy chip producer in the market. Just a moment ago, we were discussing the topic of dependability, and one of the things that we said was that NVIDIA has plans to look for more partners in addition to the leading Korean company Samsung.

Among these objectives is the search for collaborators in various other nations. With the support of these various other partners, NVIDIA will be able to boost the dependability of its products.

NVIDIA anticipates that its artificial intelligence (AI) inventory will generate large sales in the years to come, with AI graphics processing units (GPUs) like the H100s taking the lead in terms of sales volume. This prediction was made based on the company’s analysis of historical trends.

In light of the prediction made by Team Green that it will ship millions of H100s by the year 2024, businesses such as TSMC and SK Hynix are exerting a great deal of effort to swiftly expand the manufacturing capabilities of their own in-house facilities.

This is being done in order to fulfil the requests that have been placed for these particular goods. This is as a result of the fact that it should come as no surprise that Team Green would want “higher production” from the partners with whom it negotiates the terms of its purchases of commodities.

News source

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agarapuramesh
agarapurameshhttps://govindhtech.com
Agarapu Ramesh was founder of the Govindhtech and Computer Hardware enthusiast. He interested in writing Technews articles. Working as an Editor of Govindhtech for one Year and previously working as a Computer Assembling Technician in G Traders from 2018 in India. His Education Qualification MSc.
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