Huawei Expects P70 Launch Next Year, New Rumour Doesn’t Reveal Kirin 9000S Successor
As a result of the solid demand for smartphones in the Mate 60 series that has been coming from China, Huawei now has sufficient motivation to launch the P70 in the year that will follow. The supply chain of the company’s 2024 flagship device is said to have been divulged, including the identities of the manufacturers who will mass assemble its under-screen optical fingerprint scanner module, according to a recent rumour.
This information was allegedly leaked. This information was provided from a source that wishes to remain anonymous. It is noteworthy to notice that the rumour does not disclose the chip set that would be utilised as the successor to the Kirin 9000S, since this would be very relevant information.
There are allegations that Huawei has three partners in its supply chain for the under-screen fingerprint scanner that is said to be incorporated in the P70. This information comes from rumours that have been heard about the company.
The process of Huawei starting to collect up supply chain partners for the P70 is said to have already begun, according to a rumour that was published by MyDrivers and discovered by Huawei Central. This data was extracted from an article that was just published. The 2024 flagship model is said to have an optical fingerprint reader that is embedded under the display.
This scanner is anticipated to be supplied by not one, not two, but all three of the aforementioned companies: Goodix, GigaDevice, and Weir. According to one of the claims, Huawei is believed to have to acquire an optical under-screen scanner from three separate manufacturers. Why is it stated that Huawei must do this?
It would seem that this is due to the fact that the price of the optical fingerprint scanner has grown by 15–20 percent while the price of other goods that are comparable has increased by 30 percent. It is feasible that the price of the components that make up the P70 will be decreased if additional suppliers are brought on board; however, this does not clarify which chipset would be utilised to power the device’s internal components.
Will Huawei continue to use a more advanced SoC in the P70, despite the existence of the Kirin 9000S in the Mate 60 series, or will it be compelled to re-use the Kirin 9000S owing to a lack of alternative options? Despite the presence of the Kirin 9000S in the Mate 60 series, will Huawei continue to utilise a more sophisticated SoC in the P70?
A new claim suggests that the Kirin 9000S is not a genuine 7nm silicon and that SMIC, the Chinese semiconductor company that mass produced the SoC, created the chip on its 14nm process while adding enhancements so that it operates on par with a 7nm-class component. This claim indicates that SMIC, the Chinese semiconductor company that mass produced the SoC, created the chip on its 14nm process while adding enhancements so that it operates on par with a 7nm-class component.
Assuming that this is true, SMIC would be able to build a chipset that is just slightly more advanced than the Kirin 9000S by using the same manufacturing procedures but with slightly more advanced components.
It is unfortunate that it will not have access to EUV gear; as a consequence, it will be compelled to build silicon on an earlier node than it would have liked. We believe that Huawei will eventually need to begin competing with rivals in this industry, and if we acquire any fresh information on the P70, we will make sure to keep our readers informed of any new information that we obtain.
