Tuesday, November 12, 2024

PCB01 SSD for Artificial Intelligence PCs from SK Hynix

- Advertisement -

Today, SK Hynix Inc announced that it has created PCB01, an SSD product with the greatest specs in the industry, specifically for on-device AI PCs.

The device introduces innovation to performance, including data processing speed, and is the first in the industry to use the fifth generation of 8-channel  PCIe technology.

A significant international client has validated the performance and dependability of PCB01, a PCIe fifth-generation SSD used in on-device AI PCs.

- Advertisement -

1. On-device AI: A system that integrates AI operations directly into the device, bypassing the need for a physically remote server to do computation. The direct information gathering and processing capabilities of smartphones enable quick responses from AI systems and offer enhanced, personalised AI services.

2. PCIe: A high-speed input/output interface with a serialization format used on digital device motherboards.

Designed with AI computers in mind, and able to load LLMs in under one second

3. Large language model (LLM): Language models that have been created via extensive data training are crucial for generative AI tasks including text creation, summarization, and translation.

- Advertisement -

PC makers provide a framework that swiftly moves data from internal PC storage to DRAMs for AI operations, storing an LLM in order to enable on-device AIs. The PC’s internal PCB01 allows the loading of LLMs effectively throughout this operation. SK Hynix anticipates that these features of their most recent SSD will significantly improve the quality and performance of on-device AIs.

Additionally, PCB01 provides a 30% boost in power efficiency over its predecessor, enabling it to efficiently manage power from complex AI calculations. Furthermore, SK Hynix has included single-level cell (SLC) caching technology into the device, allowing some NAND cells in the storage regions to function as SLCs with quick processing rates. The technology accelerates the operation of AI services and standard PC operations by enabling the fast reading and writing of specific data.

4. Single-level cell (SLC): Memory cell type utilized in NAND flash; each SLC may hold a single bit of data. A memory cell may become a multi-level cell (MLC), a triple-level cell (TLC), and so on depending on how much data it can store. Although more data may be stored in the same space, stability and performance suffer. SLC expedites the processing of chosen data.

5. Compute Express Link (CXL): An integrated interface that links RAM, CPUs, GPUs, and accelerators.

6. GDDR7: The seventh generation of graphics memory, which enhances the speed and efficiency of GPU operation.

A channel is a path via which data can be inputted or outputted from an SSD controller to a NAND flash. The PCIe advances to the following generations and data processing speed increases with an increase in the number of channels. Conventional PCs usually use an 8-channel SSD, whereas high-performance PCs use a 4-channel SSD.

3Peripheral Component Interconnect Express (PCle): a high-speed, serially organised input/output interface found on digital device motherboards

The business anticipates that the most recent development in NAND solutions will strengthen its leadership in the AI memory field overall and add to its list of achievements in the high-performance DRAM segment, which is headed by HBM.

SK Hynix intends to mass produce and begin distributing the goods to both corporate customers and general consumers within this year after completing a validation procedure with a global PC customer.

The PCB01 SSD raises the bar for SSD performance with its sequential read and write rates of 14GB and 12GB per second, respectively. A large language model, or LLM, for AI training and inference, may operate at these speeds in less than a second.

Additionally, compared to the previous generation, the product’s power efficiency has improved by over 30%, which improves the stability of large-scale AI computing activities.

SLC caching was also used by SK Hynix in the PCB01 production process. A PC user can enjoy faster performance for both AI services and traditional computing with the adoption of the technology that inserts the single-level cell, or SLC, in certain regions of the NAND cell to accelerate performance.

Additionally, the device has a feature designed to safeguard personal information. The Root of Trust6, or ROT, is a security solution that SK Hynix engineers incorporated into the PCB01 to guard against external cybersecurity threats as well as information forging and falsification. It also secures the password of the user.

NAND storage uses single-level cells (SLCs) to store one bit of data. Depending on its data storage capacity, a memory cell can be an MLC, TLC, or QLC. Increased data storage can fit more data, but speed and stability will decrease. SLCs make it possible to process chosen data more quickly.
Root of Trust (RoT): a component of the hardware that, in terms of security, can always be relied upon, allowing for the prevention of information forgeries and falsification.

The PCB01 will be available from the firm in three capacities: 1TB, 2TB, and 512GB.
Ahn Hyun, SK Hynix’s Head of the N-S Committee, stated that many international CPU manufacturers for on-device AI PCs are asking for cooperation in the compatibility assessment process. “SK Hynix intend to strengthen SK Hynix position as the leading AI memory provider in the world by effectively completing the customer validation and mass production of PCB01, which will be prominently displayed in the NAND solution space.”

SK Hynix PCB01 SSD Specs

SpecificationDetail
ModelSK hynix PCB01
Form FactorM.2 2280
InterfacePCIe Gen3 x4 NVMe 1.3
Capacity128GB, 256GB, 512GB, 1TB
NAND Flash3D NAND
ControllerSK hynix in-house controller
Sequential Read SpeedUp to 3500 MB/s
Sequential Write SpeedUp to 3000 MB/s
Random Read IOPSUp to 600,000 IOPS
Random Write IOPSUp to 550,000 IOPS
Endurance150 TBW (128GB), 300 TBW (256GB), 600 TBW (512GB), 1200 TBW (1TB)
MTBF (Mean Time Between Failures)1.5 million hours
Power ConsumptionActive: 6W, Idle: 50mW
Operating Temperature0°C to 70°C
Dimensions22 x 80 x 2.38 mm
WeightApprox. 8 grams
Warranty5 years
- Advertisement -
Cheekuru Bhargav
Cheekuru Bhargav
Cheekuru Bhargav has been writing Laptops, RAM and SSD articles for govindhtech from OCT 2023. He was a science graduate. He was an enthusiast of Laptops.
RELATED ARTICLES

Recent Posts

Popular Post

Govindhtech.com Would you like to receive notifications on latest updates? No Yes