TSMC is aiming towards a “aggressive” expansion of the CoWoS containers that it employs in order to create place for artificial intelligence chips that will be developed by AMD and NVIDIA This will allow TSMC to better accommodate these chips
There is No Way That TSMC Would Be Left Out of This, and the Taiwanese Giant Has Every Intention of Satisfying Their Customers, Including NVIDIA and AMD
It is estimated that by the beginning of the year 2024, manufacturing will have expanded to anywhere between 15,000 and 20,000 wafers from its current level of about 12,000 wafers at the present, there are approximately 12,000 wafers being made
Fab enterprises such as TSMC have been struck with demand that was not foreseen, and as a result, the company is now having trouble keeping up with the orders that have already been made for its various products
Just a moment ago, we were discussing the topic of dependability, and one of the things that we said was that NVIDIA has plans to look for more partners in addition to the leading Korean company Samsung
Among these objectives is the search for collaborators in various other nations With the support of these various other partners, NVIDIA will be able to boost the dependability of its products
In light of the prediction made by Team Green that it will ship millions of H100s by the year 2024, businesses such as TSMC and SK Hynix are exerting a great deal of effort to swiftly expand the manufacturing capabilities of their own in-house facilities
NVIDIA anticipates that its artificial intelligence (AI) inventory will generate large sales in the years to come, with AI graphics processing units (GPUs) like the H100s taking the lead in terms of sales volume