Erying’s B760M Motherboards Feature 13th Generation Intel Core i9-13900H Central Processing Units with 95W Thermal Design Power (TDP), and Come With Vapor Chamber Cooling
The business merges laptop “BGA” CPUs and fuses them on a broad variety of motherboards with mATX and ITX form factors
The Core i9-13900H, Core i7-13700H, and Core i5-13500H central processing units (CPUs) from Intel are now available on the Erying B760M motherboards
Support for dual-channel DDR4, with a maximum frequency of 3200 MT/s, is included in the newly released B760M models
The vapor chamber cooler appears to be doing its job when equipped with a pretty conventional LGA 115x cooler
This is evidenced by the fact that the Core i9-13900H only reaches a maximum temperature of 61 degrees Celsius when subjected to the AIDA64 stress test
In terms of the input and output ports that are built into the Erying B760M, there are a total of four USB 2.0 interfaces, two USB 3.2 interfaces, two HDMI interfaces, and one DisplayPort interface
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