MediaTek officially announced the launch of its new Dimensity 6000 series of chipsets, along with a specific chipset designed to enhance mainstream 5G devices. The Dimensity 6100+ SoC (System-on-Chip) is aimed at delivering premium features at an affordable price point, including exceptional power efficiency, vivid displays, high frame rates, AI-powered camera technologies, reliable Sub-6 5G connectivity, and leading low power consumption.
According to CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, the demand for chipsets catering to the growing number of mainstream mobile devices with next-generation connectivity is crucial. As developing markets continue to roll out 5G networks and operators in developed markets transition consumers from 4G LTE to 5G, MediaTek aims to enable device makers to stay ahead of the curve by offering impressive upgrades that enhance performance, increase power efficiency, and reduce material costs.
The Dimensity 6100+ chipset integrates an enhanced 5G modem that supports the 3GPP Release 16 standard, providing up to 140MHz 2CC 5G Carrier Aggregation. This integration significantly reduces power consumption, thanks to MediaTek UltraSave 3.0+ technology. The chip features two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores, which offer notable enhancements such as AI-powered camera support, 10-bit displays, excellent user experience (UX) and GPU performance, and rich peripheral features.
Features:
- World’s 1st TSMC N4 (4nm-class) smartphone chip
- Octa-core CPU with Arm Cortex-X2 at 3.05GHz
- World’s 1st Arm Mali-G710 MC10 graphics processor
- World’s 1st simultaneous triple camera 10-bit HDR video recording
- Brand new AI processor with up to 4X power efficiency gains over the previous generation
- MediaTek HyperEngine 5.0 featuring AI-VRS, and the industry’s first raytracing SDK using Vulkan for Android.
- Leading 3GPP Release-16 5G Smartphone Modem with up to 7Gbps downlink 5G Speeds
- Latest Dual SIM Dual 4G/5G Active (DR-DSDA) technology
- Latest Wi-Fi 6E 2×2 (BW160) connectivity
- World’s 1st Bluetooth 5.3 support in smartphones
- Premium 10-bit display support: Reproduces more than one billion colors for vibrant images and videos, along with support for 90Hz to 120Hz frame rates for a smooth user experience.
- UltraSave 3.0+ technology offers 20% reduced 5G power consumption compared to competitive solutions.
MediaTek’s 5G portfolio covers various price tiers, making great mobile experiences more accessible. The Dimensity 9000 series is designed for flagship smartphones and tablets, the Dimensity 8000 family caters to premium mobile devices, and the Dimensity 7000 lineup expands MediaTek’s range of high-tech devices. With the introduction of the Dimensity 6000 series, MediaTek aims to bring higher-end features to mainstream 5G devices.
The first smartphones featuring the Dimensity 6100+ chipset are expected to be available in the third quarter of 2023.
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