Exploring MediaTek’s Groundbreaking 3nm Chip Technology

MediaTek’s first chip, which was created using TSMC’s 3nm technology, was a success, and the business hopes to begin commercial manufacturing in 2024

MediaTek and TSMC (TWSE: 2330, NYSE: TSM) announced today that MediaTek has successfully created its first chip by using TSMC’s state-of-the-art 3nm technology. This news was made public by both companies. This marks the completion of the tape-out for MediaTek’s flagship system-on-chip (SoC), which is named Dimensity, and it is anticipated that volume manufacturing will start within the next year. This marks a key milestone in the ongoing strategic cooperation between MediaTek and TSMC, which has been in existence for a long time.

Both businesses are making the most of their respective capabilities in chip design and production in order to collaborate on the development of flagship system-on-chips (SoCs) that have characteristics that are both high performing and low power consuming. These chips enable global end devices.

“We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “We are committed to our vision of using the world’s most advanced technology to create cutting edge products.” “Our products will improve our lives in meaningful ways,” he stated.

“We are excited about this.” Because of TSMC’s constant and high-quality production capabilities, MediaTek is able to fully showcase its superior design in flagship chipsets. This allows MediaTek to compete more effectively in the market. This makes it possible for MediaTek to provide the highest possible levels of performance and quality to our customers all around the globe and enhances the user experience in the flagship market.

“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means that the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means that the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket.

” Dimension System-on-Chip is what “Dimensity” stands for in its full name. “Over the course of the past several years, we have collaborated closely with MediaTek to introduce a number of significant innovations to the market, and we are honoured to continue our partnership into the 3nm generation and beyond.”

TSMC’s 3nm process technology provides enhanced performance, reduced power consumption, and increased yield, in addition to complete platform compatibility for high-performance computing and mobile application development. Compared to TSMC’s N5 process, the company’s 3nm technology claims to enhance logic density by about 60 percent, a gain in speed of up to 18 percent while keeping the same power consumption, and a decrease in power consumption of up to 32 percent while maintaining the same speed.

The ever-increasing user experience demands for mobile computing, high-speed networking, artificial intelligence, and multimedia are meant to be satisfied by MediaTek’s Dimensity System-on-Chip (SoC) devices.

These products are manufactured utilising the most cutting-edge process technology the industry has to offer, and they are designed to meet the needs of a variety of applications, including mobile computing, high-speed networking, artificial intelligence, and multimedia. It is projected that beginning in the second half of 2024, MediaTek’s first flagship chipset will be utilised to power smartphones, tablets, intelligent cars, and a range of other electronic devices. This chipset will be made utilising TSMC’s 3nm technology.

A Few Words About TSMC

TSMC was a pioneer in the pure-play foundry business model when it was first created in 1987, and ever since that time, it has been the most successful dedicated semiconductor foundry in the whole world. In order to free the creative potential of the global semiconductor industry, the firm supports a thriving ecosystem of global customers and partners with the most cutting-edge process technologies and a portfolio of design enablement solutions currently available on the market.

The Taiwan Semiconductor Manufacturing Company (TSMC) is committed to becoming a good corporate citizen all over the world, and its operations span the globe from Asia to Europe to North America.

TSMC was able to produce 12,698 products and deploy 288 distinct process technologies for a total of 532 customers in the year 2022 because the company provided the broadest variety of advanced, specialty, and advanced packaging technology services. Hsinchu is the city that serves as the site of the headquarters for the corporation in Taiwan.

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