Tuesday, July 16, 2024

MediaTek Dimensity 7300X Delivers Smooth And Fast Gaming

The greatest 5G smartphone processor options for high-end designs are the MediaTek Dimensity 7300 and Dimensity 7300X, which provide next-generation performance for seamless multitasking, remarkable battery life, and amazing displays. The contents of these 5G processors are as follows:

Outstanding Battery Life: Even for the most discerning smartphone users, this ultra-efficient 4nm processor provides best-in-class power efficiency to extend battery life.

Superb Image Quality: With a 200MP primary camera supported by the Imagiq 950 12-bit HDR-ISP, clear photographs are possible under any lighting circumstances thanks to precise face detection, noise reduction, and video HDR. Compared to earlier generations, it offers up to 1.3X faster live focus and 1.5X faster photo remastering. Additionally, 4K HDR video captures a 50% greater dynamic range than rival models.

Amazing Displays: The MediaTek MiraVision 955 enhances media streaming and HDR video playback while supporting WFHD+ displays with 10-bit true colour, providing smartphones with billion colour displays.

Specifically Designed for Flip Phone Designs: With dedicated support for dual displays, the MediaTek 7300X is especially made for flip phone designs.

Accelerated gaming: Up to 20% more frames per second and 20% more energy efficiency are possible with the combination of MediaTek HyperEngine, a potent octa-core CPU (which includes Arm Cortex-A78 processors), and the Arm Mali-G615 GPU compared to competing alternative platforms. Major studio support and the expanding gaming ecosystem contribute to the power and performance enhancements of VRS.

Advanced Connectivity: The processor has Bluetooth 5.4 compatibility, tri-band Wi-Fi 6E, and MediaTek Lightning Connect, which quickens Bluetooth connection times. Based on face proximity, holding posture, and device orientation, MediaTek UAC 2.0 maximises antenna performance.

Enhanced AI Computing: Supporting new mixed precision data types for better performance, power economy, and graphics, the MediaTek NPU 655 offers two times the AI work efficiency of the previous generation.

5G R16 Modem: New 3CC carrier aggregation offers better average speeds and longer reach, while cellular downlink rates have improved to 3.27Gb/s. In typical 5G usage settings, MediaTek 5G UltraSave 3.0+ offers 13–30% more power efficiency than competing options.

Smartphones with Dual VoNR: Premium audio and video call quality is provided by dual 5G SIM phones with dual VoNR.

MediaTek Dimensity 7300X

Superior Power Efficiency

With its next-generation capabilities and best-in-class power efficiency, this ultra-efficient 4nm-class CPU promises seamless multitasking, transcendent captures, superior performance, and improved AI-enhanced computing.

Superior Visual Clarity

For outstanding photography, the MediaTek Imagiq 950 offers a top-tier 12-bit HDR-ISP that supports a 200MP primary camera. When coupled with new hardware engines that offer video HDR, face detection (HWFD), and accurate noise reduction (MCNR), the image quality of captures is guaranteed to surpass experiences with clarity and crispness in any lighting scenario. Compared to previous generation Dimensity, live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster. Capture 4K HDR video with a dynamic range that is more than 50% broader than competing platforms’ offerings, adding more clarity to videos to produce amazing effects while using less power.

Specialised Assistance for Flip Phones with Dual Displays

Flip phones with two displays can now be supported by MediaTek MiraVision 955, with the primary display offering remarkably detailed WFHD+ resolution and 10-bit true colour. A multitude of international HDR standards enhance media streaming and playback, guaranteeing top-notch cinematic experiences while on the road.

Quick Gaming

Together, the 4X high frequency big-core processors in the octa-core CPU, the most recent Arm Mali-G615 GPU, and MediaTek HyperEngine optimisations enable the Dimensity 7300X to accelerate gaming with up to 20% more frames per second and improve energy efficiency by up to 20% when compared to competitor options.

Major studio support and the expanding gaming ecosystem contribute to the power and performance enhancements of VRS. Optimised 5G and Wi-Fi game connections, intelligent resource optimisation, Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio, and more are some of the other improvements to the entire smartphone experience.

Bluetooth 5.4, Wi-Fi 6E, and Special Connectivity Features

The most recent version of the Bluetooth standard and tri-band Wi-Fi 6E, which offers incredibly dependable and quick multi-gigabit wireless connectivity, are examples of wireless connectivity.

While MediaTek Wi-Fi/Bluetooth hybrid coexistence technologies ensure that Wi-Fi and earphones, or peripherals like gamepads, work together flawlessly without compromising latency and networking speeds, MediaTek Lightning Connect twice the speed at which Bluetooth connections can be made, enabling quicker than ever device connections.

Depending on the direction of the device, the proximity of the hand or face to the device, and even the fold status of flip phones, MediaTek UAC 2.0 optimises antenna performance for wireless connectivity.

Improved Artificial Intelligence

The MediaTek NPU 655, which offers two times the performance of the previous generation, improves AI task efficiency and supports new mixed precision data types. This opens up new possibilities for device manufacturers to offer users improved performance, better visuals, better power efficiency, and new experiences.

3CC-CA Compatible 5G R16 Modem

Faster 5G with Greater Range

By using 3CC carrier aggregation to address a maximum of 140MHz cellular spectrum, 5G downlink speeds of up to 3.27Gb/s can be achieved, offering better downlink speeds in urban and suburban areas. With the application of mixed duplex FDD+TDD, which combines the benefits of low and mid-band, smartphones in CA can enjoy higher speeds and a wider range. Additionally, carrier aggregation allows for a smooth changeover between two 5G connection areas at the coverage layer, giving consumers more than 30% more throughput layer coverage than they would have without CA.

5G UltraSave 3.0+ MediaTek

In typical 5G sub-6GHz connectivity circumstances, MediaTek 5G UltraSave 3.0+ offers a full range of R16 power saving advancements in addition to MediaTek’s own optimisations that yield 13–30% higher power efficiency than competing options.

Two 5G SIMs

Customers have more options and superior voice and video call quality with dual 5G SIM and dual VoNR.

Mediatek Dimensity 7300X Specs

Processor

CPU

  • 4x Arm Cortex-A78 up to 2.5GHz
  • 4x Arm Cortex-A55

Cores

Octa (8)

Memory and Storage

Memory Type

  • LPDDR4x
  • LPDDR5

Max Memory Frequency

Up to 6400Mbps

Storage Type

UFS 3.1

Connectivity

Cellular Technologies

2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA, WDCDMA

Specific Functions

SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 3CC 140MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2×2 MIMO, 256QAM VoNR / EPS fallback

Peak Downlink Speed

3.27Gbps

GNSS

  • GPS
  • BeiDou
  • Glonass
  • Galileo
  • QZSS
  • NavIC

Wi-Fi

Wi-Fi 6E (a/b/g/n/ac/ax)

Wi-Fi Antenna

2T2R

Bluetooth

5.4

Camera

Max Camera Sensor

200MP

Max Video Capture Resolution

4K30 (3840 x 2160)

Camera Features

  • Hardware Face Detection
  • Hardware MCNR
  • 4K Video HDR
  • AI-3A with AE, AWB, AF
  • Video EIS
  • Dual simultaneous video capture
  • All-pixel AF

Graphics

GPU Type

Arm Mali-G615 MC2

Video Encoding

  • H.264
  • HEVC

Video Playback

  • H.264
  • HEVC
  • VP-9

Display

Max Refresh Rate

  • WFHD+ @ 120Hz
  • Full HD+ @ 144Hz

AI

MediaTek 6th generation NPU

NPU 655

agarapuramesh
agarapurameshhttps://govindhtech.com
Agarapu Ramesh was founder of the Govindhtech and Computer Hardware enthusiast. He interested in writing Technews articles. Working as an Editor of Govindhtech for one Year and previously working as a Computer Assembling Technician in G Traders from 2018 in India. His Education Qualification MSc.
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