Intel Foundry Event
Intel is dedicated to protecting the domestic chip supply chain and regaining semiconductor supremacy as the sole American firm that develops and produces semiconductors. Through the development of innovative, secure solutions, Intel hopes to strengthen the resilience of U.S. technological systems by working with the U.S. government (USG).
Projects like the State-of-the-Art Heterogeneous Integration Prototype (SHIP) and Rapid Assured Microelectronics Prototypes-Commercial (RAMP-C) with the U.S. Department of Defense (DoD) have greatly accelerated the development of advanced semiconductor technologies and are prime examples of how bringing public and commercial interests together can spur innovation and improve national security.
With Intel constant dedication and the crucial role Intel Foundry played, it have made incredible progress.
Industry-leading Intel 18A process technology has entered risk production
Using the state-of-the-art Intel 18A process node from Intel Foundry has revolutionized the defense industry. Leading-edge technology is now available to USG and Defense Industrial Base (DIB) customers simultaneously with commercial customers for the first time in decades. The size, weight, power, and cost (SWaP-C) requirements of the military sector will be significantly improved by DIB customers using Intel 18A technology for their newest microelectronics and mission platforms.
The final Intel 18A PDK 1.0.1GA was made available to consumers in Q4 2024, and Intel 18A technology is currently in risk production, according to Kevin O’Buckley, SVP and GM of Intel Foundry.
Building support for ITAR-compliant test chips on Intel 18A
Enabling access to test chips made with Intel 18A technology under the International Traffic in Arms Regulations (ITAR) was one of the most interesting announcements made during IPSS. This feature guarantees that DIB clients can take use of cutting-edge technologies while still fulfilling the regulations for their programs. Reservations are being accepted for the Intel 18A ITAR test chip shuttle for tape-outs scheduled for the first half of 2026.
Expanding the Foundry roadmap with the 12nm offering
Starting in 2026, Intel Foundry will provide an industry-standard 12nm process technology to clients who require onshore access to established technologies. This technology is intended to be produced in Arizona and will make use of FinFET capabilities. Beginning in late 2026, DIB clients can start designing tape-outs.
Scaling advanced packaging onshore
Intel Foundry provides its cutting-edge heterogeneous packaging technologies, such as Foveros 3D, EMIB 3.5D, and Embedded Multi-die Interconnect Bridge (EMIB), onshore to meet the demands of mission systems. Customers may swiftly define, develop, produce, test, and integrate cutting-edge devices into field equipment by utilizing chiplet libraries and modern semiconductor packaging. Intel cutting-edge packaging technologies are crucial for applications like autonomous systems and secure communications, offering the performance and security needed for mission-critical operations, and they enable the most recent military technology to be made available in sophisticated system-level packaging for programs like SHIP.
Expanding USG partnership with Secure Enclave and new DIB customers
The Secure Enclave (SE) program, which builds on Intel’s programmatic involvement across major USG defense programs like SHIP and RAMP-C, was awarded to Intel last year. The goal of the SE program is to increase the U.S. government’s reliable production of cutting-edge semiconductors.
As part of the third phase of the RAMP-C initiatives, Intel Foundry announced earlier this year that two new DIB clients, Reliable MicroSystems and Trusted Semiconductor Solutions, will be onboarded. More DIB clients will be able to benefit from Intel Foundry’s cutting-edge Intel 18A process technology and sophisticated packaging for high-volume manufacturing and prototypes with their integration.
Intel Foundry is Ready to Serve
The Intel Foundry is ready and able to handle the various demands of government applications. Intel Foundry is well-positioned to provide high-performance, dependable, and secure semiconductor solutions because to its state-of-the-art Intel 18A process technology, sophisticated packaging options, and secure production capabilities. With the help of State-of-the-art (SOTA) technology and close cooperation with the USG and DoD, Intel Foundry is prepared to be a reliable partner in the development of microelectronics for vital government applications.
Intel Foundry Direct Connect
On April 29, 2025, in San Jose, California, don’t miss top annual event, Intel Foundry Direct Connect, if you’re prepared to network with professionals in government, defense, and aerospace technologies. Learn how the process technology, cutting-edge packaging, and testing may help your ideas by connecting with clients, defense industry technologists, and USMAG (U.S. Military, Aerospace, and Government) alliance ecosystem partners. At 9 a.m. PDT, CEO, Lip-Bu Tan, will begin the event. Sign up now to take advantage of this chance to learn about the design and manufacturing of systems foundries in the future.
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