Get Ready! Erying’s B760M – Core i9-13900H Inside

Erying B760M motherboards

Erying has released its brand new B760M motherboards, which include up to Intel Core i9-13900H CPUs and Vapor Chamber cooling. These new motherboards have been offered by the company.

Erying’s B760M Motherboards Feature 13th Generation Intel Core i9-13900H Central Processing Units with 95W Thermal Design Power (TDP), and Come With Vapor Chamber Cooling.

Erying has just recently released its brand-new B760M motherboards, which feature Intel 13th Generation CPUs with up to Core i7-13620H options. However, the company has now released a higher-end variant in its B760M series, which comes with Intel’s Core i9-13900H CPU running at 95W TDPs and also receives improved CPU cooling in the form of a vapor chamber heatsink.

Erying has taken a novel approach to the design of motherboards; specifically, the business merges laptop “BGA” CPUs and fuses them on a broad variety of motherboards with mATX and ITX form factors; these motherboards are then placed under a huge IHS. Their product is designed to provide customers with significantly more “cost-effective” alternatives.

The Core i9-13900H, Core i7-13700H, and Core i5-13500H central processing units (CPUs) from Intel are now available on the Erying B760M motherboards. Instead of using the same copper IHS (current-gen), the company has adopted a higher-end vapor-chamber heatsink to sustain the 95W TDP of Intel’s high-end 13th Gen CPUs. In general, the design of each motherboard continues to uphold the same tradition, with the pre-installed IHS, along with a similar color scheme. However, rather than using the same copper IHS (current-gen), the company has also changed the color scheme.

When opposed to other generations, Erying’s incorporation of a high-end processor from Intel’s 13th Generation will unquestionably bring additional performance aboard. However, the corporation has opted to continue using the components that it has been using in the past, such as the power supply interface and the VRM power phases. Support for dual-channel DDR4, with a maximum frequency of 3200 MT/s, is included in the newly released B760M models. In terms of its compatibility with various storage devices, the motherboard features not one but two PCIe 4.0×4 M.2 slots in addition to two SATA connections.

The vapor chamber cooler appears to be doing its job when equipped with a pretty conventional LGA 115x cooler. This is evidenced by the fact that the Core i9-13900H only reaches a maximum temperature of 61 degrees Celsius when subjected to the AIDA64 stress test.

In terms of the input and output ports that are built into the Erying B760M, there are a total of four USB 2.0 interfaces, two USB 3.2 interfaces, two HDMI interfaces, and one DisplayPort interface. The connectivity is poor, but considering that Erying is aiming for the cheap market, which does not require high-end I/O, you can’t really expect much from them anyhow. Although Erying has not officially released the prices of its separate motherboard models, consumers may reasonably anticipate that the prices will fall somewhere in the region of USD $230–$360.

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