AMD EPYC 9004 Processors with 3D V-Cache technology

What is AMD 3D V-CACHE™ TECHNOLOGY?

Some AMD EPYC 9004 Series Processors include AMD 3D V-Cache™ die stacking technology that enables more efficient chiplet integration. AMD 3D Chiplet architecture stacks L3 cache tiles vertically to provide up to 96MB of L3 cache per die (and up to 1152MB L3 Cache per socket) while still providing socket compatibility with standard AMD EPYC™ 9004 Series Processor models.

AMD EPYC 9004 Series Processors with AMD 3D V-Cache technology employ industry-leading logic stacking based on copper-to-copper hybrid bonding “bumpless” chip-on-wafer process to enable over 200X the interconnect densities of current 2D technologies (and over 15X the interconnect densities of other 3D technologies using solder bumps),3,4 which translates to lower
latency, higher bandwidth, and greater power and thermal efficiencies

AMD has expanded its 4th Gen AMD EPYC processor family by introducing two additional processor models

1.The AMD EPYC 97×4 processors, codenamed “Bergamo” and

2. The AMD EPYC 9004 processors with AMD 3D V-Cache technology, codenamed “Genoa-X.”

These processors continue the legacy of the 3rd Gen AMD EPYC 7003 processors with AMD 3D V-Cache technology by offering a significantly larger L3 cache. With up to 1,152MB of L3 cache per CPU, the AMD EPYC 9xx4 processors leverage the same design as the general-purpose 4th Gen AMD EPYC processors and add AMD 3D V-Cache technology to stack additional SRAM directly on top of the compute die, tripling the total L3 cache size. This larger cache can store a significantly larger working dataset, reducing pressure on memory bandwidth and accelerating technical computing workloads.

The AMD EPYC 9004 processors with AMD 3D V-Cache technology include other cutting-edge features such as “Zen 4” cores built on 5nm process technology, 12 channels of DDR5 memory with supported speeds up to 4800GHz, up to 128 (1P) or 160 (2P) lanes of PCIe Gen5 for faster data transfer rates, 3rd Gen Infinity Fabric for improved data transfer, and AMD Infinity Guard technology for data security. These processors are socket compatible with existing 4th Gen AMD EPYC platforms.

Model Specifications

The AMD EPYC 9004 Series processors have set over 300 world records and are known for their performance, energy efficiency, and optimal total cost of ownership (TCO). They have a wide ecosystem of partners that offer data center solutions, including cloud providers, software vendors, hardware manufacturers, and more.

We Can See performance results for various technical computing workloads, focusing on Computational Fluid Dynamics (CFD) and Explicit Finite Element Analysis (FEA) applications. It showcases benchmarks for software such as Altair AcuSolve, Ansys CFX, Ansys Fluent, and OpenFOAM, comparing the performance of AMD EPYC processors with Intel Xeon processors. The results demonstrate the significant performance advantages of AMD EPYC 9004 processors with AMD 3D V-Cache technology, both at the system level and on a per-core basis.

Computational Fluid Dynamics (CFD)

CFD uses numerical analysis to simulate and analyze fluid flow and how that fluid (liquid or gas) interacts with solids and surfaces, such as the water flow around a boat hull or the aerodynamics of a car body or aircraft fuselage, as well as a wide variety of less obvious uses, including industrial processing and consumer packaged goods.

AMD EPYC 9004 processors with AMD 3D V-Cache technology can significantly improve the performance of CFD workloads. With up to 1,152MB of L3 cache, more of the workload’s total working dataset can fit into ultra-fast L3 cache memory situated in close proximity to the compute cores.

Here Seen the Various Differences Of AMD EPYC and Intel Xeon with Graphical Method

AMD EPYC 9384X outperformed Intel Xeon Platinum 8462Y+ by approximately 1.35x on benchmarks, while OpenFOAM® outperformed comparable systems by 2.08x and 1.77x on a composite motorbike model.

Explicit Finite Element Analysis (FEA)

Explicit Finite Element Analysis (FEA) is a numerical simulation technique used to analyze the behavior of structures and materials subjected to dynamic events, such as impact, explosions, or crash simulations. For example, the automotive industry uses FEA to analyze vehicle designs and predict both a car’s behavior in a collision and how that collision might affect the car’s occupants.

Altair Radioss is a tool for structural analysis under impact or crash conditions, with benchmarks measuring hardware performance data. AMD EPYC 9684X and EPYC 9384X systems outperformed Intel Xeon Platinum 8480+ and Intel Xeon Platinum 8462Y+ systems, respectively. Ansys LS-DYNA® is a simulation program capable of simulating complex real-world short-duration events in various industries. AMD EPYC 9004 processors with AMD 3D V-Cache technology offer impressive performance for technical computing workloads, minimizing time to solution and reducing software licensing costs. The 4th Gen AMD EPYC processors with AMD 3D V-Cache technology deliver exceptional performance for memory bandwidth bound workloads.

Super-linear scaling

Super-linear scaling, which occurs when adding more computational nodes to a cluster leads to accelerated performance. AMD testing showed super-linear scaling with the OpenFOAM Motorbike model, where the performance increased significantly as more nodes were added.

AMD remains committed to delivering high-performance data center processors and continues to innovate with products like the 4th Gen AMD EPYC processors and AMD EPYC 9004 processors with AMD 3D V-Cache technology. These processors offer exceptional performance and efficiency, addressing the evolving needs of various market segments and verticals.